서버 리셀러
Original brand Server PowerEdge R660 Xeon CPU
Performance, meet versatility
Where performance and density meet. More compute in less space with this dense 1U server designed for demanding workloads including artificial intelligence, database analytics and high-density virtualization.
* Add up to two 4th generation Intel® Xeon® Scalable processors with up to 56 cores for faster and more accurate processing performance
* Accelerate in-memory workloads with up to 32 DDR5 RDIMMS up to 4800 MT/sec (1DPC)
* Maximize performance with up to 3X single-wide GPUs for finishing workloads faster
* Put more data in a smaller footprint with storage options that include up to 8 x 2.5″ NVMe/SAS4/SATA, plus up to 10 x 2.5″ NVMe/SAS4/SATA
* Add up to two 4th generation Intel® Xeon® Scalable processors with up to 56 cores for faster and more accurate processing performance
* Accelerate in-memory workloads with up to 32 DDR5 RDIMMS up to 4800 MT/sec (1DPC)
* Maximize performance with up to 3X single-wide GPUs for finishing workloads faster
* Put more data in a smaller footprint with storage options that include up to 8 x 2.5″ NVMe/SAS4/SATA, plus up to 10 x 2.5″ NVMe/SAS4/SATA
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프로세서
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최대 2개의 4세대 인텔 제온 스케일러블 프로세서, 최대 56 cores and optional Intel QuickAssist Technology
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기억
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• 32 DDR5 DIMM 슬롯, RDIMM 지원 8 최대 TB, 최대 속도 4800 MT/초
• Supports registered ECC DDR5 DIMMs only
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스토리지 컨트롤러 |
• 내부 컨트롤러 (습격): 퍼크 H965i, 퍼크 H755, 퍼크 H755N, 퍼크 H355, HBA355i
• 내부 부팅: 부팅 최적화 스토리지 하위 시스템 (보스-N1): 헤어레이드 2 x M.2 NVMe SSD drives, 또는 USB
• External HBAs (비 RAID): HBA355e
• 소프트웨어 RAID: 시즌 160
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전면 포트
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• 1 x iDRAC 다이렉트 (마이크로 AB USB) 항구
• 1 엑스 USB 2.0
• 1 엑스 VGA
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기동성
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OpenManage 모바일
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차원
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• Height – 42.8 밀리미터 (1.68 인치)
• Width – 482 밀리미터 (18.97 인치)
• Depth – 822.88 밀리미터 (32.39 인치) 베젤 포함 809.04 밀리미터 (31.85 인치) 베젤 없음
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폼 팩터
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1 U 랙 서버
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Power Supplies
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• 1800W Titanium 200-240 VAC 또는 240 HV디씨, hot swap with full redundant
• 1400W Platinum 100-240 VAC 또는 240 HV디씨, hot swap with full redundant
• 1100W Titanium 100-240 VAC 또는 240 HV디씨, hot swap with full redundant
• 1100W LVDC -48 – -60 VDC는, hot swap with full redundancy
• 800W Platinum 100-240 VAC 또는 240 HV디씨, hot swap with full redundant
• 700 W Titanium 200-240 VAC 또는 240 HV디씨, hot swap with full redundant
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냉각 옵션
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• 공랭식
• Optional Direct Liquid Cooling (DLC)
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Embedded Management
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• iDRAC9 • iDRAC Direct • iDRAC RESTful API with Redfish
• iDRAC Service Module • Quick Sync 2 무선 모듈
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네트워크 옵션
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1 x OCP 카드 3.0 (선택적)
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