Revendedores de servidores
Dell PowerEdge R660 – Specifications & Operating Environment
1. Specifications
- Factor de forma: 1Servidor en rack U
- Procesador: 2× 4th/5th Gen Intel Xeon Scalable
- Memoria: Up to 32× DDR5 DIMMs, max 8TB
- Almacenamiento: Up to 10× 2.5″ SAS/SATA/NVMe + 2× rear drives
- Expansion: PCIe Gen5, OCP 3.0 networking
- Poder: Dual hot-plug redundant PSU
- Administración: iDRAC9 Enterprise
- Puertos: 10GbE/25GbE flexible network options
2. Operating Environment
- Operating Temperature: 10°C – 35°C
- Operating Humidity: 10% – 80% (non-condensing)
- Operating Altitude: Up to 3000m
- Power Input: 100–240V AC, 50/60Hz
- Cooling: Server rack forced air cooling
- Deployment: Data center, server room, cloud infrastructure
|
Modelo
|
|
|
Factor de forma
|
|
|
Procesador Maxim
|
Up to two 4th Generation Intel Xeon Scalable processors, con hasta 56 cores and optional Intel® QuickAssist Technology
|
|
CARNERO
|
• 32 Ranuras DIMM DDR5, soporta RDIMM 8 TB máx., Velocidades de hasta 4800 MT/s
• Solo admite DIMM DDR5 ECC registrados |
|
Hard disk
|
Compartimentos delanteros:
•Hasta 10 x 2,5 pulgadas, SAS/SATA/NVMe (Disco duro/SSD) máximo 153.6 TUBERCULOSIS •Hasta 8 x 2,5 pulgadas, SAS/SATA/NVMe, (Disco duro/SSD) máximo 122.88 TUBERCULOSIS Compartimentos traseros: •Hasta 2 x 2,5 pulgadas, SAS/SATA/NVMe, máximo 30.72 TUBERCULOSIS |
|
Controladoras de almacenamiento
|
• Controladores internos (INCURSIÓN): PERC H965i, PERC H755, PERC H755N, PERC H355, HBA355i
• Arranque interno: Subsistema de almacenamiento optimizado para arranque (JEFE-N1): HWRAID 2 x M.2 NVMe SSD drives, or USB • External HBAs (no RAID): HBA355e • RAID de software: S160 |
|
Fuente de alimentación
|
• 1800 W Titanio 200—240 VCA o 240 HVDC, Intercambio en caliente con redundancia completa
• 1400 W Platino 100—240 VCA o 240 HVDC, Intercambio en caliente con redundancia completa • 1100 W Titanio 100—240 VCA o 240 HVDC, Intercambio en caliente con redundancia completa |
|
Aficionados
|
• Standard (ETS) fans/High performance Gold (VHP) aficionados
•Hasta 4 sets (dual fan module) Ventiladores de conexión en caliente |
|
Dimensiones
|
•Altura– 42.8 milímetro (1.68 Pulgadas)
•Ancho– 482 milímetro (18.97 Pulgadas) •Profundidad– 822.88 milímetro (32.39 Pulgadas) con bisel 809.04 milímetro (31.85 Pulgadas) sin bisel |
|
NIC integrada
|
2 x 1 Tarjeta GbE LOM (opcional)
|
|
Network options
|
1 x OCP card 3.0 (opcional)
Nota: The system allows either LOM card or an OCP card or both to be installed in the system. |
|
Pcie
|
Up to three PCIe slots :
• Slot 1 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x8/ 1 x16 Gen 5 o 1 x16 Gen 4 Low profile, Half length • Slot 2 : 1 x16 Gen5 Full height, 3/4 length, Half length or 1 x16 Gen 5 o 1 x16 Gen 4 Low profile, Half length • Slot 3 : 1 x8/ 1 x16 Gen 5 o 1 x16 Gen 4 Low profile, Half length |
|
GPU Options
|
Hasta 2* x 75 W SW
|
